EANS-Adhoc: WACKER Closes Semiconductor Wafer Production in Japan
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ad-hoc disclosure pursuant to section 15 of the WpHG transmitted by euro
adhoc with the aim of a Europe-wide distribution. The issuer is solely
responsible for the content of this announcement.
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Decommissioning of Production Capacities
08.12.2011
Munich, December 8, 2011 - Siltronic, Wacker Chemie AG's semiconductor division,
intends to streamline its 200 mm wafer production capacities. As a result,
Siltronic plans to close its production site in Hikari, Japan, by mid-2012. The
Munich-based chemical group announced this decision today. Hikari's production
volumes shall be transferred to Siltronic's existing 200 mm wafer plants in
Singapore and Portland (Oregon, USA), optimizing capacity utilization at these
sites' facilities. The planned closure is expected to involve expenses of some
EUR70 million. Thereof, around EUR45 million will be cash-relevant. These
expenses had not been included in WACKER's most recent earnings forecast for
fiscal 2011 which calls for earnings before interest, taxes, depreciation and
amortization (EBITDA) at last year's level. Currently, Siltronic is producing at
it's Hikari site wafers for the semiconductor industry as well as
monocrystalline silicon ingots, employing a staff of some 500.
Further inquiry note:
Investor Relations
Tel.: +49 (0)89 6279 1633
E-Mail: investor.relations@wacker.com
end of announcement euro adhoc
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issuer: Wacker Chemie AG
Hanns-Seidel-Platz 4
D-81737 München
phone: +49 (0) 89 6279 01
FAX: +49 (0) 89 6279 1770
mail: info@wacker.com
WWW: http://www.wacker.com
sector: Chemicals
ISIN: DE000WCH8881
indexes: MDAX, CDAX, Prime All Share
stockmarkets: regulated dealing/prime standard: Frankfurt, free trade: Hamburg,
Stuttgart, Düsseldorf, Hannover, München, regulated dealing: Berlin
language: English