Atmel Announces 0.18um RF CMOS Foundry Process for Low Volume Applications
San Jose, California, November 9 (ots/PRNewswire)
- With Optional EEPROM, On-Chip Aluminum Inductors, 5 or 6 Metal Layers
Atmel(R) Corporation (Nasdaq: ATML), announced today its 0.18 micron AT58900 RF CMOS process technology for ASIC foundry customers whose products require high speed, low power RF devices, such as those used in WLAN, WiMAX and ZigBee applications. This new process is manufactured on 200mm wafers and features 1.8V CMOS transistors and a vast array of passive components that include low tolerance analog poly resistors, N+ and P+ S/D resistors, and up to four metal layers. RF pads are included to help minimize interface impedance.
Optional features include single poly EEPROM for on-chip analog trimming or low density data storage. Minimization of circuit noise can be achieved using optional triple well isolation transistors, low channel-leakage MOS transistors, and isolated NMOS transistors. Other optional features include high Q, low noise metal-insulator-metal capacitors, and P+/N- varactors for optimum linearity. On-chip thick aluminum inductors are available for impedance matching, which reduces off-chip component requirements. Designers have access to fifth and sixth metal layers to help simplify signal routing. A 3.3 volt input/output interface can be incorporated eliminating the need for off-chip voltage doublers.
- Atmel offers frequent multi-project wafer (MPW) runs that provide an economical means for customers to debug prototype RF devices without purchasing an entire mask set. Multiple customers share the same reticle and wafer-run, thereby reducing the cost of entry. Prices for MPW runs are dependent on the die size.
Production -- Atmel accepts minimum order quantities (MOQ) as low as US$250K per year for production foundry products. All backend services including test, characterization, qualification, design verification, and supply chain management are available if required.
Design Kits -- Atmel offers a wide range of mature design libraries and a Cadence design kit for the AT58900 that supports accurate mixed signal simulation between digital, analog and RF circuits. The digital standard cell libraries are supported in OPUS.
Atmel's 58900 0.18 micron RF CMOS process is available now.
About Atmel
Atmel is a worldwide leader in the design and manufacture of microcontrollers, advanced logic, mixed-signal, nonvolatile memory and radio frequency (RF) components. Leveraging one of the industry's broadest intellectual property (IP) technology portfolios, Atmel is able to provide the electronics industry with complete system solutions. Focused on consumer, industrial, security, communications, computing and automotive markets, Atmel ICs can be found Everywhere You Are(R).
NOTE: Atmel(R), logo and combinations thereof, Everywhere You Are(R) and others, are the registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.
Information:
Information on Atmel's 58900 RF CMOS process is available at www.atmel.com/products/rfcmos/ or contact rfcmos@atmel.com.
Press Contacts
Barbara Bailey, Marketing Communications Manager -- SiGe BiCMOS and RF
CMOS Foundry
Phone: +1-719-540-1895, Email: bbailey@cso.atmel.com
Veronique Sablereau, Corporate Communications Manager -- Europe
Phone: +33-1-30-60-70-68, Fax: +49-71-31-67-24-23,
Email: veronique.sablereau@atmel.com
Clive Over, Director of Press Relations -- USA and Asia
Phone: +1-408-451-2855, Email: cliveover@atmel.comWeb site: http://www.atmel.com
Contact:
Barbara Bailey, Marketing Communications Manager -- SiGe BiCMOS and
RF CMOS Foundry, +1-719-540-1895, or bbailey@cso.atmel.com, or
Veronique Sablereau, Corporate Communications Manager -- Europe,
+33-1-30-60-70-68, or fax, +49-71-31-67-24-23, or
veronique.sablereau@atmel.com, or Clive Over, Director of Press
Relations -- USA and Asia, +1-408-451-2855, or cliveover@atmel.com,
all of Atmel