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The Latest Breakthrough in Silicon Carbide Wafer Edge Profiling / Synova's Laser MicroJet® (LMJ) technology achieves outstanding results in SiC wafer edge beveling and profiling and is set to revolutionize the semiconductor industry
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Actualités de DUILLIER, Switzerland
- Langue:
- Médias:
- Période:
- Période:Totale
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Synova Celebrates Its 25th Anniversary and the Success Story of the Laser MicroJet® / The hybrid process combines laser and water to process new materials with the highest precision and quality
plus SYNOVA files lawsuit against Sitec for patent infringement
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SYNOVA’s growth continues with new subsidiary in Germany
plus SYNOVA has filed an appeal against Avonisys with the Swiss Federal Supreme Court
plusSynova Launches Ultra-Precise Laser Machining Center LCS 305
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